What We Do Capabilities Analytical Services and Failure Analysis Electronics and Instrumentation Engineering, CAD and CAE Flip Chip Services Flip Chip Tooling Holonics Lapping, Polishing, CMP and ELG Magnetic Recording Heads Micro-Assembly Nano Devices Photolithography Photonic Crystals Precision Machining Thin Films and Devices Tooling Design & Fabrication Wafer Bonding Wafer Dicing Manufacturing Apertures and Aperture Strips Flip Chip Tooling Tooling Design & Fabrication Services Analytical Services and Failure Analysis Electronics and Instrumentation Flip Chip Services Lapping, Polishing, CMP and ELG Micro-Assembly Precision Machining Thin Films and Devices Tooling Design & Fabrication Wafer Bonding Wafer Dicing Products Apertures and Aperture Strips Flip Chip Tooling Magnetic Recording Heads Industries Semiconductor Flip Chip Services Flip Chip Tooling Photolithography Thin Films and Devices Photonics Flip Chip Services Flip Chip Tooling Micro-Assembly Photolithography Thin Films and Devices Military/Aerospace Electronics and Instrumentation Precision Machining Medical Device Micro-Assembly Photolithography Precision Machining National Lab Flip Chip Tooling Micro-Assembly Photolithography Precision Machining Thin Films and Devices Data Storage Magnetic Recording Heads Scientific Instruments Apertures and Aperture Strips

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