Our precision wafer dicing technology is at the forefront of the industry in terms of precision and wafer materials.

Arc can handle many materials such as silicon, alumina, ceramic, ferrite, quartz, glass, sapphire, GaAs, and SiC.

Arc offers the following dicing capabilities:

• Wafer/Substrate dicing up to 200 mm (7.9 in) diameter
• Wafer thicknesses: 100 µm – 10 mm (4 to 394 mils)
• Single pitch 0.5 µm over 50 mm (0.02 mils over 2 in), cumulative pitch accuracy of 1.5 µm over 160 mm (0.06 mils over 6.3 in)
• Cuts as small as 20 µm (0.8 mil) wide
• Dicing of die < 25 µm (1 mil) square
• Beveled-cut dicing

With sub-micron pitching accuracy and over 100 man-years of blade knowledge, the resulting parts not only meet incredible mechanical specifications but are also beautiful to behold.

We dice magnetic recording heads from AlTiC, and make many creative ceramic tools with a combination of technologies from the dicing to grinding to true 3D machining.

 Additional services include slotting, singulating, angling, machining grooves, and cutting through layered assemblies, sapphire, and glass.