With precision aligners and bonders from Suss Microtec, Arc Technologies provides wafer bonding services for your most demanding applications.

While Flip Chip bonding has been the "new thing" at Arc for 2008, we will are planning on Wafer Bonding to be the "new thing" at Arc for 2008.

Glass frit and sputter glass bonding are also a mainstream technology at Arc Technologies.

Arc Technologies is currently offering wafer bonding tooling for up to 300 mm wafer sizes.

Arc Technologies is currently under negotiation for a CB8, wafer-to-wafer Bond Tool from Suss MicroTec.

Arc will be providing wafer bonding services begining in Q1 2008.

Please send any inquiries about this new offering to us so we can plan accordingly, or just call!